Name: CPU 1.375X1.375 THERM PAD 34.93X34.93MM TAN
Brand: Bergquist
SKU: CPU 1.375X1.375
Price: 40.00 USD
Availability: InStock
Rating: 4.9 (2 reviews)

Question 1

What is the Mfr

Accepted Answer

Mfr refers to the component's producing company, whose brand and manufacturing processes directly impact the component's performance, consistency, and traceability, making it a key reference during selection.

Question 2

What is the Series

Accepted Answer

Series indicates a manufacturer’s organized range of components, often named with a common prefix or code, to streamline product selection and ensure compatibility across similar models.

Question 3

What is the Thickness

Accepted Answer

Thickness is a fundamental linear dimension specifying the distance between two parallel surfaces of a component or material, typically measured in millimeters (mm) or inches (in). It is a critical mechanical parameter that directly influences structural

Question 4

What is the Type

Accepted Answer

This parameter categorizes a component based on its fundamental operating principle, internal structure, or primary application domain. It serves as the highest-level identifier, grouping devices with shared core characteristics—such as "N-Channel MOSFET,

Question 5

What is the Product Status

Accepted Answer

Product Status indicates the commercial availability and production stage of the component, such as Active, Not for New Design (NRND), Obsolete, or Last Time Buy (LTB).

Question 6

What is the Storage/Refrigeration Temperature

Accepted Answer

This parameter specifies the safe ambient temperature range for storing a component when it is not powered or in active use, typically measured in degrees Celsius (°C). It defines the environmental limits that prevent physical degradation, such as moistur

Question 7

What is the Shelf Life Start

Accepted Answer

Shelf Life Start refers to the date from which the maximum storage duration for a component is calculated. This period defines how long a part can be stored under specified environmental conditions (e.g., temperature, humidity) before its performance or r

Question 8

What is the Shelf Life

Accepted Answer

This parameter specifies the maximum duration, typically in months or years, that a component can be stored under defined environmental conditions (e.g., temperature, humidity) before its specified performance characteristics may begin to degrade. It is c

Question 9

What is the Thermal Resistivity

Accepted Answer

A measure of a material's inherent ability to impede heat flow, defined as the temperature difference per unit length per unit of heat power. It is the intrinsic property of a substance, independent of geometry, and is the reciprocal of thermal conductivi

Question 10

What is the Color

Accepted Answer

A visual attribute determined by the wavelength of light reflected or emitted, used for rapid identification, polarity marking, functional grouping (e.g., resistor bands, LED emission, wire jackets), and status indication of components within a system.

Question 11

What is the Usage

Accepted Answer

It specifies the intended application or operational environment for which a component is designed and tested, guiding engineers in selecting parts that meet the specific electrical, mechanical, and reliability requirements of their system. This parameter

Question 12

What is the Outline

Accepted Answer

The physical dimensions and shape of a component's package, typically defined by a standardized drawing or code (e.g., DIP, SOIC, QFN). This specification dictates the required space on a PCB, the component's mounting compatibility, and its suitability fo

Question 13

What is the Thermal Conductivity

Accepted Answer

A material's inherent ability to conduct heat, quantified as the rate of heat transfer through a unit thickness per unit area under a temperature gradient. Its base unit is watts per meter-kelvin (W/(m·K)). This property is fundamental for selecting mater

Question 14

What is the Adhesive

Accepted Answer

A substance used to create a permanent or semi-permanent bond between surfaces, providing mechanical attachment, sealing, or thermal/electrical conduction. In electronics, it secures components, manages heat transfer via thermally conductive fillers, or p

Question 15

What is the Backing, Carrier

Accepted Answer

A flexible substrate or support layer, typically made from materials like polyester (PET), polyimide (PI), or paper, which provides mechanical integrity and dimensional stability to adhesive films, labels, or flexible circuits. Its thickness and material

Question 16

What is the Material

Accepted Answer

The specific substance or combination of substances from which a component is primarily fabricated. This fundamental specification determines key physical, electrical, and thermal properties, including conductivity, resistivity, mechanical strength, therm

Question 17

What is the Shape

Accepted Answer

The physical form or outline of a component's package, which dictates its mechanical fit, mounting compatibility, and spatial footprint on a PCB. It is a primary identifier (e.g., cylindrical, rectangular, radial, axial) that determines handling, assembly

Bergquist CPU 1.375X1.375

4651

SP600-02

SP600-25

SP600-104

SPK10-0.006-00-58

SPK10-0.006-00-105

SPK10-0.006-00-104

Q3-0.005-00-58

Q3-0.005-00-105

Q3-0.005-00-90