Name: HSIB916-1 AC, HEAT SPREADER FOR IB916/ IB9
Brand: iBASE Technology
SKU: HSIB916-1
Price: 24 USD
Availability: InStock
Rating: 4.9 (2 reviews)

Question 1

What is the Mfr

Accepted Answer

Mfr refers to the component's producing company, whose brand and manufacturing processes directly impact the component's performance, consistency, and traceability, making it a key reference during selection.

Question 2

What is the Series

Accepted Answer

Series indicates a manufacturer’s organized range of components, often named with a common prefix or code, to streamline product selection and ensure compatibility across similar models.

Question 3

What is the Package

Accepted Answer

his term denotes the protective casing (often made of plastic, ceramic, or metal) that encapsulates an integrated circuit, determining its size, reliability, and suitability for different mounting technologies like through-hole or SMT.

Question 4

What is the Fin Height

Accepted Answer

Fin Height refers to the vertical distance from the base of a heat sink's fin to its tip, typically measured in millimeters (mm). This dimension directly determines the total surface area available for convective heat dissipation and is a critical factor

Question 5

What is the Material Finish

Accepted Answer

This specification describes the surface treatment applied to a component's base material to enhance its performance, durability, or aesthetics. Common finishes include plating (e.g., gold for low contact resistance, tin for solderability), anodizing (for

Question 6

What is the Type

Accepted Answer

This parameter categorizes a component based on its fundamental operating principle, internal structure, or primary application domain. It serves as the highest-level identifier, grouping devices with shared core characteristics—such as "N-Channel MOSFET,

Question 7

What is the Width

Accepted Answer

Width refers to the lateral dimension of an electronic component, measured perpendicular to its length and height. It is a critical physical parameter that defines the component's footprint on a printed circuit board (PCB) and influences layout density, m

Question 8

What is the Product Status

Accepted Answer

Product Status indicates the commercial availability and production stage of the component, such as Active, Not for New Design (NRND), Obsolete, or Last Time Buy (LTB).

Question 9

What is the Package Cooled

Accepted Answer

This specification indicates that the primary mechanism for dissipating heat from a semiconductor device is through direct conduction into the printed circuit board (PCB) via its leads, solder joints, and any exposed thermal pad (e.g., PowerPAD™, exposed

Question 10

What is the Attachment Method

Accepted Answer

The specific mechanical means by which a component or assembly is physically secured to a substrate, chassis, or another part. This includes techniques such as adhesive bonding, screw fastening, snap-fitting, press-fitting, or welding. The chosen method i

Question 11

What is the Power Dissipation @ Temperature Rise

Accepted Answer

This parameter specifies the maximum power a component can dissipate while maintaining its case or junction temperature rise within a specified limit above the ambient temperature, typically measured in Watts (W) per degree Celsius (ΔT). It quantifies the

Question 12

What is the Thermal Resistance @ Forced Air Flow

Accepted Answer

This parameter quantifies the effectiveness of a heat transfer path from a component's junction to the ambient environment when active cooling is applied. It is defined as the temperature rise per unit of power dissipated (ΔT/P), with units of degrees Cel

Question 13

What is the Material

Accepted Answer

The specific substance or combination of substances from which a component is primarily fabricated. This fundamental specification determines key physical, electrical, and thermal properties, including conductivity, resistivity, mechanical strength, therm

Question 14

What is the Diameter

Accepted Answer

A fundamental linear dimension specifying the width of a circular or cylindrical object, such as a wire, connector, shaft, or lens. It is a critical geometric parameter that determines mechanical fit, current-carrying capacity, optical properties, and spa

Question 15

What is the Length

Accepted Answer

Length refers to the linear dimension of a component along its primary axis, typically measured in millimeters (mm) or inches (in). It is a fundamental physical parameter that defines the component's spatial footprint, influences mechanical fit within an

Question 16

What is the Thermal Resistance @ Natural

Accepted Answer

This parameter quantifies the temperature rise per unit of power dissipated when a component (typically a semiconductor package or heat sink) operates in still air without forced airflow. It is measured in degrees Celsius per Watt (°C/W) and defines the i

Question 17

What is the Shape

Accepted Answer

The physical form or outline of a component's package, which dictates its mechanical fit, mounting compatibility, and spatial footprint on a PCB. It is a primary identifier (e.g., cylindrical, rectangular, radial, axial) that determines handling, assembly

iBASE Technology HSIB916-1

504102B00000G

507222B00000G

501603B00000G

580300B00000G

551002B00000G

578305B00000G

574502B00000G

501200B00000G

531002B00000G

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