Name: 387003013 THERMOELECTRIC MODULE HI TEMP
Brand: Laird Thermal Systems, Inc.
SKU: 387003013
Price: 40.00 USD
Availability: InStock
Rating: 4.9 (2 reviews)

Question 1

What is the Mfr

Accepted Answer

Mfr refers to the component's producing company, whose brand and manufacturing processes directly impact the component's performance, consistency, and traceability, making it a key reference during selection.

Question 2

What is the Series

Accepted Answer

Series indicates a manufacturer’s organized range of components, often named with a common prefix or code, to streamline product selection and ensure compatibility across similar models.

Question 3

What is the Package

Accepted Answer

his term denotes the protective casing (often made of plastic, ceramic, or metal) that encapsulates an integrated circuit, determining its size, reliability, and suitability for different mounting technologies like through-hole or SMT.

Question 4

What is the Product Status

Accepted Answer

Product Status indicates the commercial availability and production stage of the component, such as Active, Not for New Design (NRND), Obsolete, or Last Time Buy (LTB).

Question 5

What is the Number of Stages

Accepted Answer

This parameter specifies the total count of individual, cascaded functional units within a multi-stage electronic component, such as an amplifier, voltage multiplier, or filter. It defines the component's complexity, overall gain, frequency response, and

Question 6

What is the Operating Temperature

Accepted Answer

The operating temperature is the range of ambient temperature within which a power supply, or any other electrical equipment, operate in. This ranges from a minimum operating temperature, to a peak or maximum operating temperature, outside which, the powe

Question 7

What is the Height

Accepted Answer

Height refers to the vertical dimension of a component, measured perpendicularly from its mounting or reference plane to its highest point. This critical mechanical parameter determines the component's spatial footprint and influences clearance, stacking

Question 8

What is the Size / Dimension

Accepted Answer

This parameter specifies the physical measurements of a component, typically expressed as length, width, height, and/or diameter in millimeters or inches. It defines the component's spatial footprint, which is critical for mechanical integration, PCB layo

Question 9

What is the Features

Accepted Answer

These are the additional, non-core capabilities or characteristics integrated into a component beyond its primary function. They enhance performance, reliability, or ease of use, such as built-in protection (thermal shutdown, overcurrent), enable/disable

Question 10

What is the Delta Tmax @ Th

Accepted Answer

This parameter specifies the maximum allowable temperature difference between the component's case or heatsink mounting surface (Tc or Th) and the ambient air (Ta) for a given power dissipation. It is a key thermal resistance metric, expressed in degrees

Question 11

What is the Qmax @ Th

Accepted Answer

This parameter specifies the maximum heat flow rate (in Watts) that a thermoelectric cooler (TEC) or Peltier module can pump from its cold side to its hot side when a specific temperature difference (ΔT, in °C or K) is maintained between its two sides. It

Laird Thermal Systems, Inc. 387003013

CP20251

CP30338

CP60133

CP60240

CP85238

56460-501

430801-504

430436-504

56760-505

56500-501