Name: 0326.031H FUSE CERAMIC 31MA 250VAC 3AB 3AG
Brand: Littelfuse Inc.
SKU: 0326.031H
Price: 40.00 USD
Availability: InStock
Rating: 4.9 (2 reviews)

Question 1

What is the Mfr

Accepted Answer

Mfr refers to the component's producing company, whose brand and manufacturing processes directly impact the component's performance, consistency, and traceability, making it a key reference during selection.

Question 2

What is the Series

Accepted Answer

Series indicates a manufacturer’s organized range of components, often named with a common prefix or code, to streamline product selection and ensure compatibility across similar models.

Question 3

What is the Package

Accepted Answer

his term denotes the protective casing (often made of plastic, ceramic, or metal) that encapsulates an integrated circuit, determining its size, reliability, and suitability for different mounting technologies like through-hole or SMT.

Question 4

What is the DC Cold Resistance

Accepted Answer

DC Cold Resistance is the DC resistance presented by a component (e.g., motor winding, lamp filament) at a standard temperature and without self-heating from high current.

Question 5

What is the Package / Case

Accepted Answer

Package / Case refers to the protective housing that encases an electronic component, providing mechanical support, electrical connections, and thermal management.

Question 6

What is the Product Status

Accepted Answer

Product Status indicates the commercial availability and production stage of the component, such as Active, Not for New Design (NRND), Obsolete, or Last Time Buy (LTB).

Question 7

What is the Operating Temperature

Accepted Answer

The operating temperature is the range of ambient temperature within which a power supply, or any other electrical equipment, operate in. This ranges from a minimum operating temperature, to a peak or maximum operating temperature, outside which, the powe

Question 8

What is the Mounting Type

Accepted Answer

Mounting Type refers to the standardized classification of the method by which an electronic component or module is physically secured and electrically connected to a printed circuit board, chassis, or panel. It defines how the component integrates into t

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